pb lead-free parts - 2007 24 - apr. la38b-88/h-pf led array ligitek electronics co.,ltd. property of ligitek only data sheet doc. no : qw0905-la38b-88/h-pf rev : a date :
1/5 la38b-88/h-pf 3.8 3.0 1.5max 1.0 3.8 0.5 typ 2.54typ 1.0min 25.0min ligitek electronics co.,ltd. property of ligitek only page part no. package dimensions lh4840-pf note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. + - + - 3.8 0.5 typ 2.54typ 5.2 3.0 7.0 1.0 3.5 0.5 3.8
t opr -40 ~ +85 operating temperature typical electrical & optical characteristics (ta=25 ) max. forward voltage @20ma(v) 2.6 note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. red emitted la38b-88/h-pf gap part no material red diffused 6971.7 color lens peak wave length pnm min. storage temperature tstg -40 ~ +100 0.8 0.5 130 viewing angle 2 1/2 (deg) luminous intensity @ ma(mcd) typ. 10 min. ligitek electronics co.,ltd. property of ligitek only ratings peak forward current duty 1/10@10khz reverse current @5v power dissipation forward current parameter ir pd i fp i f symbol absolute maximum ratings at ta=25 a 10 40 mw 15 60 ma ma h unit page 2/5 spectral halfwidth ? nm 90 part no. la38b-88/h-pf
r e l a t i v e i n t e n s i t y @ 2 0 m a 600 0.0 0.5 wavelength (nm) 700800900 ambient temperature( ) fig.5 relative intensity vs. wavelength fig.3 forward voltage vs. temperature f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 1.0 -20 -40 0.8 1.0 0.9 1.1 1.2 0.5 r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 -20 ambient temperature( ) 80 60 40 20 0-40 100 0.0 80 60 02040100 fig.4 relative intensity vs. temperature 2.5 1.5 1.0 2.0 3.0 fig.1 forward current vs. forward voltage typical electro-optical characteristics curve 100 f o r w a r d c u r r e n t ( m a ) 0.1 1.0 1.0 10 1000 h chip r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a forward voltage(v) 2.03.04.05.01.0 0.0 1.5 1.0 0.5 2.0 2.5 forward current(ma) 101001000 fig.2 relative intensity vs. forward current 3.0 ligitek electronics co.,ltd. property of ligitek only 1000 3/5 page part no. la38b-88/h-pf
60 seconds max page 4/5 ligitek electronics co.,ltd. property of ligitek only 2.wave soldering profile soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to case) temp( c) 260 260 c3sec max 5 /sec max 100 time(sec) 150 2 /sec max 120 25 preheat 0 0 50 note:1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to case) part no. la38b-88/h-pf
page 5/5 reference standard jis c 7021: b-12 mil-std-883:1008 jis c 7021: b-10 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 description test item test condition reliability test: operating life test high temperature storage test 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) low temperature storage test 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. ligitek electronics co.,ltd. property of ligitek only mil-std-202:103b jis c 7021: b-11 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 high temperature high humidity test 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles thermal shock test solderability test 1.t.sol=230 5 2.dwell time=5 1sec 1.t.sol=260 5 2.dwell time= 10 1sec. solder resistance test the purpose of this test is the resistance of the device under tropical for hours. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. this test intended to see soldering well performed or not. part no. la38b-88/h-pf
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